Difficulties and Breakthroughs in the Design of Analog-digital Mixed Signal Circuits for Integrated Circuits

Kangrui Wan

doi:10.54254/2753-8818/2025.AD26471

Theoretical and Natural ScienceOpen access

Difficulties and Breakthroughs in the Design of Analog-digital Mixed Signal Circuits for Integrated Circuits

Research Article

Open Access

Difficulties and Breakthroughs in the Design of Analog-digital Mixed Signal Circuits for Integrated Circuits

Kangrui Wan ^1*

¹ Dalian University of Technology

^*Corresponding author: 17691073996@163.com

Published on 3 September 2025

TNS Vol.134

ISSN (Print): 2753-8826

ISSN (Online): 2753-8818

ISBN (Print): 978-1-80590-343-7

ISBN (Online): 978-1-80590-344-4

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Abstract

With the continuous advancement of modern electronic technology, analog and digital circuits are increasingly being supplanted by analog-digital mixed signal circuits, which have the advantages of both, so the development of integrated circuits focuses on analog-digital mixed signal circuits. This paper employs a comprehensive research approach, combining literature review and case studies, to conduct an in-depth exploration of analog-digital mixed-signal circuit design in ICs. First, the paper discusses the definition of analog-digital mixed circuits, analyses the application of analog-digital mixed circuits in the field of communications, automotive and other areas and development trends. This text explores the design challenges of analog-digital mixed circuits, including noise interference, device mismatches, process bias, and low power consumption. It also discusses the integration of analog-digital mixed circuits in integrated circuits and highlights recent advancements in analog-digital hybrid circuit design, such as new circuit architecture and packaging processes.

Keywords:

analog-digital hybrid, integrated circuits, noise interference, low power consumption, advanced packaging

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References

[1]. Hu, X. G., Tao, K., & Deng, B. W. (2015). Design of analog-digital hybrid infrared channel communication device. Electronic Products World, 22(12), 27-29+36.

[2]. Liao, C. (2020). Anti-interference demodulation circuit for underground coupling communication. Electronic Production, (19), 12-17.

[3]. Tang, J. G., Wang, Y. N., Yang, H. Q., et al. (2007). Design and implementation of digital-analog conversion system for hybrid electric vehicles. Process Automation Instrumentation, (7), 17-20.

[4]. Wang, X. W. (2010). Research on low-cost testing technology for automotive intelligent power integrated circuits (Doctoral dissertation). Fudan University.

[5]. Chen, Y. S. (2022). Research on key technologies of mixed-signal integrated circuits for mobile healthcare (Doctoral dissertation). Xidian University.

[6]. Ji, M. N., Chang, M. C., Jia, Z. J., et al. (2024). Development trends and reliability evaluation methods for high-density hybrid circuit packaging technology. Integrated Circuits and Embedded Systems, 24(7), 25-29.

[7]. Lü, T., & Chen, R. (2010). Optimization analysis of crosstalk and substrate coupling noise in hybrid circuits. Electronic Process Technology, 31(3), 154-157.

[8]. Guo, R. (2015). PCB anti-interference design for digital-analog hybrid circuits. Mechanical and Electrical Information, (18), 146-147.

[9]. Zhang, Z. X. (2017). Research on methods to reduce interference in CMOS analog-digital circuits. Science and Technology Innovation Herald, 14(7), 27+29.

[10]. Yu, M. (2016). Design of bandgap reference voltage source based on process variation (Master’s thesis). Zhejiang University.

[11]. Zhang, J. H., Su, J. T., Xie, W. Y., et al. (2024). Analysis of load mismatch effects on heterojunction bipolar transistor devices based on waveform testing. High Power Laser and Particle Beams, 36(1), 34-40.

[12]. Zhang, H. (2011). Design and implementation of low-power and high-precision audio digital-to-analog converter (Master’s thesis). Zhejiang University.

[13]. Zhang, X. Q. (2017). Logic circuit design based on FinFET devices (Master’s thesis). Ningbo University, Zhejiang.

[14]. Deng, Z. H. (2024). Overview of integrated circuit technology. Integrated Circuits and Embedded Systems, 24(1), 1-12.

[15]. Tian, C. S., Chen, L., Wang, Y., et al. (2023). Research progress on electronic design automation technology based on graph neural networks. Journal of Electronics and Information Technology, 45(9), 3069-3082.

[16]. Shi, H. X., Zhu, J. C., Yan, J. C., et al. (2021). Customer repurchase prediction method based on convolutional neural network and LSTM recurrent neural network. High Technology Letters, 31(7), 713-722.

[17]. Mirhoseini, A., Goldie, A., Yazgan, M., et al. (2021). A graph placement methodology for fast chip design. Nature, 594(7862), 207-212.

[18]. Wang, G. W., Li, L., Pan, P. H., et al. (2025). Research and application status of multi-die 2.5D/3D integration technology. Journal of the University of Electronic Science and Technology of China. Advance online publication. https: //doi.org/ [insert DOI if available]

[19]. Guo, J., Feng, J. B., & Cao, G. W. (2017). Development and challenges of silicon photonics chip processes and design. ZTE Technology Journal, 23(5), 7-10.

[20]. Wu, B. B., Zhang, H. Y., Tang, X. H., et al. (2017). Research on silicon photonics technology and industry development. World Telecommunications, (2), 36-41.