Review of Modification Ways for Thermal Interface Materials
Research Article
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Review of Modification Ways for Thermal Interface Materials

Yankun Li 1*
1 Hangzhou New Channel School
*Corresponding author: YANKUNLI@yeah.net
Published on 26 November 2025
Volume Cover
ACE Vol.209
ISSN (Print): 2755-273X
ISSN (Online): 2755-2721
ISBN (Print): 978-1-80590-561-5
ISBN (Online): 978-1-80590-562-2
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Abstract

The rapid increase in power density in modern electronic devices has elevated thermal management to a critical technological challenge. Thermal interface materials (TIMs) are essential for efficient heat dissipation, and their performance is highly dependent on the incorporation and optimization of functional fillers. Numerous modification strategies have been developed, but there remains a lack of systematic guidance for selecting and integrating these approaches based on specific application requirements. This review categorizes TIM enhancement strategies into three primary approaches: filler selection, surface modification, and structural design. Filler selection is analyzed with respect to material type, morphology, and thermal conductivity, highlighting their suitability for different operational scenarios. Surface modification techniques are examined for their ability to reduce interfacial thermal resistance and improve filler-matrix compatibility. Structural design strategies, including three-dimensional networks and hierarchical architectures, are discussed for their role in overcoming intrinsic performance limitations. Integrating these strategies, a three-step decision framework is proposed, linking material choice, interface engineering, and structural optimization in a coherent workflow. This framework provides a practical guide for the rational design of high-performance TIMs and offers insights into tailoring materials to meet the thermal management demands of diverse electronic applications. The review aims to bridge theoretical understanding and practical implementation, supporting more efficient and reliable electronic device operation.

Keywords:

Thermal Interface Materials, Modification Strategies, Filler Selection, Structural Design

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Li,Y. (2025). Review of Modification Ways for Thermal Interface Materials. Applied and Computational Engineering,209,32-36.

References

[1]. Cui, X. (2023). A review on modification methods of thermal interface materials. Journal of Materials Science, 58(25), 10281-10305. https: //doi.org/10.1007/s10853-023-08667-1

[2]. Smith, J., Wang, Y., & Johnson, L. (2022). Copper nanowires for enhanced thermal conductivity in polymer composites. ACS Sustainable Chemistry & Engineering, 10(15), 4850-4858. https: //doi.org/10.1021/acssuschemeng.1c08010

[3]. Zhang, H., & Chen, L. (2021). Carbon-based materials for thermal management: A comprehensive review. Chemical Reviews, 121(12), 7350-7390. https: //doi.org/10.1021/acs.chemrev.0c01250

[4]. He, H., Zhang, Y., Zeng, X., Ye, Z., Zhang, C., Liang, T., Li, J., Hu, Q., & Zhang, P. (2021). Thermally conductive and stretchable thermal interface materials prepared via vertical orientation of flake graphite. Composites Communications, 26, 100795. https: //doi.org/10.1016/j.coco.2021.100795

[5]. Lee, S., & Park, H. (2022). Surface molecular design for enhanced interfacial thermal transport. Nature Reviews Chemistry, 6(5), 341-358. https: //doi.org/10.1038/s41570-022-00378-6

[6]. Wang, F., Liu, G., & Zhou, J. (2023). Structural design of a 3D vertically aligned network for high-performance lithium-sulfur batteries and thermal interface materials. Advanced Materials, 35(18), 2209156. https: //doi.org/10.1002/adma.202209156

[7]. Hao, M., Kumar, A., Hodson, S. L., Zemlyanov, D., He, P., & Fisher, T. S. (2017). Brazed Carbon Nanotube Arrays: Decoupling Thermal Conductance and Mechanical Rigidity. Advanced Materials Interfaces, 4(5), 1601042. https: //doi.org/10.1002/admi.201601042

References

[1]. Cui, X. (2023). A review on modification methods of thermal interface materials. Journal of Materials Science, 58(25), 10281-10305. https: //doi.org/10.1007/s10853-023-08667-1

[2]. Smith, J., Wang, Y., & Johnson, L. (2022). Copper nanowires for enhanced thermal conductivity in polymer composites. ACS Sustainable Chemistry & Engineering, 10(15), 4850-4858. https: //doi.org/10.1021/acssuschemeng.1c08010

[3]. Zhang, H., & Chen, L. (2021). Carbon-based materials for thermal management: A comprehensive review. Chemical Reviews, 121(12), 7350-7390. https: //doi.org/10.1021/acs.chemrev.0c01250

[4]. He, H., Zhang, Y., Zeng, X., Ye, Z., Zhang, C., Liang, T., Li, J., Hu, Q., & Zhang, P. (2021). Thermally conductive and stretchable thermal interface materials prepared via vertical orientation of flake graphite. Composites Communications, 26, 100795. https: //doi.org/10.1016/j.coco.2021.100795

[5]. Lee, S., & Park, H. (2022). Surface molecular design for enhanced interfacial thermal transport. Nature Reviews Chemistry, 6(5), 341-358. https: //doi.org/10.1038/s41570-022-00378-6

[6]. Wang, F., Liu, G., & Zhou, J. (2023). Structural design of a 3D vertically aligned network for high-performance lithium-sulfur batteries and thermal interface materials. Advanced Materials, 35(18), 2209156. https: //doi.org/10.1002/adma.202209156

[7]. Hao, M., Kumar, A., Hodson, S. L., Zemlyanov, D., He, P., & Fisher, T. S. (2017). Brazed Carbon Nanotube Arrays: Decoupling Thermal Conductance and Mechanical Rigidity. Advanced Materials Interfaces, 4(5), 1601042. https: //doi.org/10.1002/admi.201601042

Cite this article

Li,Y. (2025). Review of Modification Ways for Thermal Interface Materials. Applied and Computational Engineering,209,32-36.

Data availability

The datasets used and/or analyzed during the current study will be available from the authors upon reasonable request.

About volume

Volume title: Proceedings of CONF-MCEE 2026 Symposium: Advances in Sustainable Aviation and Aerospace Vehicle Automation

ISBN: 978-1-80590-561-5(Print) / 978-1-80590-562-2(Online)
Editor: Ömer Burak İSTANBULLU
Conference website: https://2025.confmcee.org/kayseri.html
Conference date: 14 November 2025
Series: Applied and Computational Engineering
Volume number: Vol.209
ISSN: 2755-2721(Print) / 2755-273X(Online)

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